Chinese
Advanced Lithography Conference & Round-Table Panel
Date 23 August 2007，(1:30-17:00pm)
Venue Shanghai ZhangIiangClub(81Chunxiao Rd.Zhangjiang Hi-tech Park ,Pudong,Shanghai
Organizer SICA, SST-AP-NMD China
Managed by ACT Internationa
Official Publication SST-AP-NMD China
Supporting media

Compound Semiconductor & OptoTech China,SolidState Technology,
Advanced Packaging, SST/AP Taiwan
Co-Chairman Xue Zi, Wang Longxing (SICA)
Vice-Chairman Adonis Mak (SST-AP-NMD China)
 
Conference Topics：

Latest nanolithography technology, including: Know-how in 90nm lithography process Successful stories in 65nm lithography promotion 45nm lithography outlookRelated technologies like process equipment, special materials and chemicals
 

Conference Profile：

Technical speech & Round-Table & communicate on own opinion with each others
Wafer manufacturers: Tell you what they need in lithography process
Nowadays and next generation lithography technologies
In Round-Table Salon, lithography equipment and materials suppliers, wafer manufacturers, research centers will discuss hot lithography topics together.(Registration)
   
※ Technical speech：
光刻技术的发展和挑战32nm even more ----------- Zhu Jun Senior principal (ICRD) Section Manager (HHNEC)
 
 Summary: As the semiconductor fabrication ground-rule has reached the 32nm node, in general there are several possible approaches for the photolithography solution such as the double exposure with 1.35 NA immersion, the high refractive index immersion, the extremely ultra violet (EUV) lithography etc. However, there are still challenges in the design and optimization of the process, the speaker will elaborate around the technology trends and challenges and will share with us his point of views on the topic.

Challenge of Lithography Technology Development and Application for China Chip Maker ----- Wan Xudong (SMIC)
   

New Challenges in Photolithography 2007 ------------------------------------------- Wu Qiang Application Manager ASML
When photolithography reaches 32 nm or below, several techniques emerge and compete with each other to become the mainstream technique, which are high index immersion, extremely ultra-violet (EUV) lithography, and dual exposure technique with source optimization. Which one of the three will become the winner depends on the maturity of the following research and development projects, which are the successful implementation and recovery/disposition of high index immersion fliud, the successful manufacturing of high index lens (such as LuAG), the successful stopping of the debris from the EUV source, the further improvement of the power of EUV source, and the further improvement of the sensitivity of EUV photoresist. The recent progress from the above projects will be introduced.

Exposure tool for bumping process ----------------------------------------------- Dr. L. Gong　Suss Micro Tec (Shanghai) Ltd
In this paper, the application of mask aligner in bumping process will be shown. We want to show how we as a equipment vendor improve the old technology and add necessary features, so that this old technology could be widely used in the modern bumping technology.
   
※ Round-Table Draft topics：
  Global nanolithography technology development trend
  Ultra Deep Sub-Micron technologies—Double exposure study and application
  Development of process equipment and materials for nanolithography technology
  Implement and outlook about 65nm and 45nm lithography
  Lithography equipment and materials local manufacturing
  The nanolithography’s influence to IC design and manufacturing yield
  Disintegration of the semiconductor industry and mask business


Speakers from：
ASML、KLA-TENCOR、TOPPAN PHOTOMASKS、Suss MicroTec、SMIC、HHNEC & others

Invite company:：
  Wafer manufacturing fabs
  Lithography equipment suppliers
  Material or chemical suppliers
  Research centers and some component makers
  LCD panel makers

Conference scale：
50-60 attendees
   
※ Special Program: Set up a Lithography Salon, organizer by SST-AP-NMD China & SICA
I want to be a member of CHIP China Lithograph Salon. (Application form)
Goals：
  Discuss the trend of global high-end lithography technology and equipment
  Learning what industry players doing——fastest way to share information
  To spread new lithography using in manufacturers based in China
  To know more about government policies
  To understand the developing and bottleneck of lithography technology
  To build a platform for fabs and lithography equipment suppliers as well as research centersTo achieve multi-sides technical communications and keep in touch with the government
 
Attendees：
  Managers of lithography dept, wafer manufacturing fabs
  Process research centers(included universities, institutes, independent R&D centers)
  Lithography equipment and materials suppliers
  IC industry association representatives or members
   

Contact Info：

    
China –Irene Lu      卢玥光 irenel@actintl.com.hk 86-21-62511200, 86-13701874849
HK and International – Adonis Mak 麦协林 Adonism@actintl.com.hk 852-90182962, 86-13825267823