Advanced Packaging and Test Conference
    China semiconductor industry has been developing at high speed in recent years; there has been substantial growth in the areas of packaging & testing, design, manufacturing. Packaging & testing plays an important role and has become the highest growth segment in the China semiconductor industry. China is now one of main world packaging & testing bases, accounts for about 15% world market share. As important as it is for the industry in China, technical professionals in China will need to acquire the latest packaging and test technology in order to enhance their production. This conference, organized by ACT International Media Group, to be held in December in Shanghai, will bridge the vendors and the technical professional, provides them with a platform for face-to-face discussion. The group’s flagship publication SAN China (SST-AP-NMD China) will be the official publication to provide all the necessary resources and support. You are cordially invited to join us in this event. We welcome contributed articles and new products and technologies information

1.         Advanced packaging (BGA/CSP/ MCM/ Flip Chip/ WLP/MLP)

2.          Micro-interconnect for packaging

- Low radian wire bonding/ TAB/ flip chip soldering/reflow soldering
- Wire bonding/wire frame/solder bumping/tiny-pitch bonding

1.       3D packaging

           - High Density PoP/SiP/SoC and Package Stacking Developing
- Cu low-k interconnecting in 3D-SIC
- 3D Packaging and Through Silicon Vias
- Wire bonded for chip stacking
- Chip Stacking Technology with Lead-free Soldering
- Chip-to-wafer and wafer-to-wafer Technology for 3D System Integration

1.          Packaging materials and processing

- Pb-free solder, underfill, adhesives, dispending, coating, etc

1.           Packaging design and reliability

- Packaging design and simulation in calorifics, electrics, mechanics… testing,   simulating and analyzing for packaging reliability
- The new developments and challenges of packaging and assembling
- PoP/SiP/SoC packaging & testing - Packaging & testing equipment
- Packaging testing and socket design
- LCD, LED, MEMS packaging & testing

1.           Packaging substrates and PCBs

             **Other topics are welcomed.

           Target audiences: Millennium MicroteTarget audiences:ch (Shanghai) , Intel, Shanghai Matsushita Semiconductor, ASE (Shanghai) , GAPT, StatsChipPAC (Shanghai) , UTAC (Shanghai) , Amkor Assembly & Test (Shanghai) , Nantong Fushitong Microelectronics, Jiangsu Changjiang Electronics Technology, Fairchild, SIPIN Technology, Chip MOS, National Semiconductor

CHIP China Series 2007
Advanced Lithography Conference 先进光刻技术研讨会　　 　　　　　　   23rd August 2007, Shanghai 上海
FPD Technical Conference FPD平板显示技术研讨会　　　　　　　　　 　 21st September 2007, Shanghai 上海
Advanced Packaging & Test Conference 先进封装和测试研讨会　　　　November 2007, Shanghai 上海

Sponsorship opportunities (cost is per conference)

Platinum Sponsor: (maximum 2 platinum sponsors)                                             US$5,000 net

Each sponsor will receive the following:

l           40 minutes to address audience w/ presentation in Platinum time slot

l           Table-top for literature display, gifts distribution, etc. in most favorable position

l           6 complimentary Conference tickets for staffs or VIP customers

l           8 pages (maximum) white papers/presentation powerpoint in conference proceeding (US$200/additional page)

l           Full page ad in attendee/conference guide in premium position (US$800 for additional FP4C)

l           2x banner ads on SAN China e-newsletter, (US$200/ additional ad each time)

l           Banner ad in SAN China website (from sponsorship confirmation to conference month)

l           Literature in carry bags

l           Logo appears in all promotion materials and in the venue (dominance positions)

l           Complete database of the attendee

l           Translation service is available

l           Special discount on advertising in SAN China and editorial coverage opportunity (consult us)

Gold Sponsor:                                                                                                  US$4,000 net

Each sponsor will receive the following

l           40 minutes to address audience w/ presentation

l           3 complimentary conference tickets for staffs or VIP customers

l           6 pages (maximum) white papers/presentation PowerPoint in conference proceeding (US$200/additional page)

l           Full page ad in attendee/conference guide (US$800 for additional FP4C)

l           2x banner ads on SAN China e-newsletter, (US$200/ additional ad each time)

l           Literature in carry bags

l           Logo appears in all promotion materials and in the venue

l           Complete database of the attendee

l           Special discount on advertising in SAN China and editorial coverage opportunity (consult us)

* Sequence of presentations will be at the discretion of the organizer. In general, favorable time slots will be allocated in descending order to Platinum and Gold

Other sponsorship opportunities:

Lunch & Tea Sponsor (one exclusive sponsor only)                                                  US$2,000 net

l            Complimentary sign on each table

l            Full page 4 color ad in attendee/conference guide

l            3 pages (maximum) white paper/article in conference proceeding

Table-Top Sponsor                                                                                                                          US$1,500 net

l            Tabletop for literature display, gifts distribution, etc.

l            Free Full Page 4 Color advertisement in Conference Guide

Advertisement in attendee/conference guide                                                                             US$800 net

l            Full Page 4 Color

l            Special discount to SAN China advertisers (consult us)

*Other sponsoring ideas welcomed

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General Inquiry:

Event Management

Event Manager - Irene Lu IreneL@actintl.com.hk tel: 86-21-62511200

Technical Director – Sunnie Zhao sunnieZ@actintl.com.hk tel: 86-10-82864727

Marcom Manager – Pauli Mak paulim@actintl.com.hk tel: 852-28386298

General Manager, China – Michael Tsui michaelT@actintl.com.hk tel: 86-755-25988571

Publisher & President – Adonis Mak adonism@actintl.com.hk tel: 852-28386298

Sponsorship

International – Kathlin Liao kathlinL@actintl.com.hk tel: 852-28386298

China – Judy Huang judyH@actintl.com.hk tel: 86-21-62511200

Sales & Marketing – Mark Mak markM@actintl.com.hk tel: 852-28386298

Contact our international sales representatives in your area, please visit www.san-china.com or contact Kathlin Liao at kathlinL@actintl.com.hk

HK-852-28386298 Shenzhen- 86-755-25988571 Shanghai-86-21-62511200 Beijing-86-10-82864727

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